Master the flow of your adhesives

説明:

Adhesives are used to connect surfaces. Usually, adhesives are applied as a liquid and harden subsequently. The curing process may occur due to temperature changes, by evaporation of solvents, humidity- or UV-light-induced chemical reactions, or just with time through the contact between adhesive and substrate.

Did you ever ask yourself how your adhesives quality control or R&D processes can benefit from rheology? From quality or process control at the production line-up to specific measurements in the development process of new products – register today and learn how Anton Paar rheometers and viscometers can help you accomplish your measuring tasks.

Covered topics include, amongst others, the following:

  • Your epoxy resin is too thin or too thick for application
  • A spray adhesive cannot be pumped or sprayed
  • The sealant does not spread on the gluing surface
  • The pot life of your adhesive is too short
  • A resin is too thin for application at 40 °C
  • The two-component adhesive hardens before application is finished
  • Two connected parts detach after glue application as the curing process is too slow
  • The shelf life of your adhesive is limited due to demixing
  • The hotmelt detaches when the room temperature is too high
  • You want to optimize the application of your UV- or humidity-curing adhesive
  • The adhesive tape breaks off when stretched under load
  • Powder raw material cannot be pumped

日付: 1970-01-01, 02:00 - 02:00 (CET UTC+01:00)
言語: English
講師: Dr. Christopher Giehl

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