Nanomechanical characterization for the semiconductor industry

Nanomechanical characterization for the semiconductor industry

Join Our Webinar: Advanced Characterization Techniques for Semiconductor Thin Films

Discover how cutting-edge techniques like nanoindentation and nanoscratch testing can be used to analyze semiconductor components and thin films.

In this webinar, we’ll explore:

- Mechanical properties of passivation layers: Learn how to assess the hardness of protective layers that shield microchips from environmental damage, ensuring they resist wear and tear effectively.
- Measuring hardness of ultra-thin films (< 200 nm): See how advanced tools make it possible to measure the mechanical properties of even the thinnest layers with precision.
- Adhesion testing with a nanoscratch tester: Find out how to evaluate the adhesion of ultra-thin films, a critical factor in ensuring durability and reliability.
This webinar is perfect for anyone involved in testing or improving hardness, elastic modulus, adhesion, or scratch resistance of semiconductor materials.

Don’t miss this opportunity to enhance your understanding of these essential characterization methods!

Dr. Jiri Nohava (English)
Dr. Jiri Nohava (English)
Jiri Nohava

Dr. Jiri Nohava is the Head of Product Competence & Lead Application Scientist at Materials Surface Characterization unit of Anton Paar. He obtained his PhD in materials science at the Czech Technical University in Prague (Czech Republic). 

He joined Anton Paar TriTec in 2007 and has since become a specialist in instrumented indentation, tribology and scratch testing. His main task is development of new applications with Anton Paar instruments in frame of scientific and industrial projects. He regularly publishes in peer-reviewed journals and participates at international conferences.

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