Solder paste | Rotational Viscosity Testing of Solder Paste with ViscoQC

Pain: The solder paste does not stay in place after printing? It can’t pass the stencil openings? Solution: Analyze viscosity and flow behavior with ViscoQC – Adopt the formulation (particle concentration, shape etc.) to overcome the issues – Control the quality of the solder paste with ViscoQC.

Solder paste is required for the manufacturing of circuit boards to connect electrical components to pads on the board. When the solder paste is heated a mechanical bond and electrical connection is created between components and the pads.

Solder paste is one of the most important materials in the so-called surface mount technology (SMT). SMT is most commonly used for low-cost consumer electronic assemblies on large production scales.

Solder powder particles are suspended in a flux binder to generate a stable solder paste suspension. The performance of solder paste depends on the solder particle amount, size, shape and other additives. By analyzing and controlling the viscosity and flow behavior of the paste, the performance of the paste can be examined. For example, the higher the amount of metal powder is, the higher the viscosity of the solder paste will be.

The application report shows example measurements for research and development as well as quality control measurements of solder paste with the rotational viscometer ViscoQC 100/300.

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