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Rheology in Advanced Packaging for AI and HPC

From Underfill to Thermal Management

Artificial intelligence (AI) and high-performance computing (HPC) are driving a rapid evolution in semiconductor packaging, placing unprecedented demands on advanced packaging materials and manufacturing processes. From underfills and die-attach materials to thermal interface materials (TIMs) and UV-curable adhesives, rheological properties govern dispensing, capillary flow, compression, curing, and long-term stability. This article demonstrates that rheological characterization extends far beyond conventional viscosity measurements, providing insight into material behavior under realistic processing conditions. Using practical examples, it illustrates how rheological testing supports material development, process optimization, and quality control, ultimately improving manufacturing yield, reliability, and thermal performance in advanced semiconductor packages.

Packaging Complexity in the AI/HPC Era

The rapid growth of AI and HPC is creating semiconductor packaging requirements on a scale not previously encountered. As transistor and power densities increase and chiplet architectures become more complex, advanced packaging technologies must integrate multiple functional materials with high precision. Increasing package complexity makes material behavior during processing a key factor in manufacturing yield, reliability, and thermal performance.

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