Adhesives | Measurement of Adhesives with the Rotational Rheometer RheolabQC
This report explains how the rheologic behavior of adhesives can be characterized with RheolabQC. A comparison of the structural decomposition, sagging behavior and yield stress of two adhesives is shown.
Adhesives are used to join surfaces by changing phase from liquid to solid. The transition is caused by a temperature change (hotmelt adhesives) or in other cases the glue hardens at ambient conditions (contact adhesives) due to solvent evaporation or due to humidity. Structural decomposition, sagging and yield stress are significant quality characteristics for such adhesives and sealants. These characteristics contribute substantially to product quality and can be observed with rheological tests.
Experimental setup
All measurements were performed with the Anton Paar rotational rheometer RheolabQC with a cylinder measuring system Z5/4 consisting of a bob Z5 (B-CC8) in a cup Z4 (C-CC15.18) with a sample volume of 17 mL. This configuration features a small bob in a large cylinder.
It would also be possible to use a CC10 bob in a CC17 cup. The specific configuration with a small bob in a larger cup improves reproducibility compared to a narrower gap. Furthermore, the positioning of the measuring system is easier. To keep cleaning to a minimum and increase throughput, disposable aluminum cups can be used. The measurement was performed with the Peltier temperature device C-PTD 180/AIR/QC for quick and accurate temperature control.
Get the document
To receive this document please enter your email below.
