Residual Stress Measurement in Polycrystalline Materials Using Iso-Inclination in X-Ray Diffraction
Stresses in polycrystalline materials arise due to mechanical or thermal loading of the sample. These stresses can be reversible or irreversible. Irreversible stresses, which persist after the external loading is removed, are known as residual stresses. X-ray diffraction is routinely used as a non-destructive technique to evaluate the residual stresses in polycrystalline bulk materials and thin films.
Introduction
In general, stresses are introduced in a material as a result of external mechanical or thermal loads. Upon removing the external loading, the stresses, should be relieved. Therefore, the sample returns to an unstressed state. However, in many cases, stresses remain in the material, even after unloading. These persisting stresses are referred to as residual stresses. Depending on the prior loading conditions and material properties, they can be either compressive or tensile.
Residual stresses can be introduced deliberately or unintentionally through surface treatments, heat treatments, mechanical deformations, thermal expansion mismatches between coating and substrate, and many others. They can have substantial influence on the performance of the material, e.g. crack formation, fatigue or fracture behavior.
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