Differential Scanning Calorimetry for Reliable Cure Monitoring of Epoxy Resins
This application report demonstrates how Differential Scanning Calorimetry (DSC) is used to accurately determine the degree of cure in epoxy resin systems, providing essential data for quality control and process optimization in electronics, optics, and advanced manufacturing.
Epoxy resins play a critical role in industries that demand extreme thermal stability, optical clarity and mechanical reliability. These include applications such as semiconductor packaging, fiber optics or advanced electronics. Ensuring optimal curing is essential, as incomplete polymerization compromises performance, resulting in reduced thermal resistance, adhesion and long-term durability. Differential Scanning Calorimetry (DSC) addresses these challenges by directly measuring residual exothermic heat and shifts in glass transition temperature, enabling accurate determination of the degree of cure.
This analysis offers manufacturers precise insights into epoxy resin curing, supporting consistent quality control for critical applications like hermetic seals, optical assemblies and high-temperature sensors. As a result, it helps reduce waste and enhance performance across the electronics, photonics and precision manufacturing sectors.
Get the document
To receive this document please enter your email below.
