Novel Approach for Scratch Analysis of Ductile Metallic Layers on Fragile Substrates
There is increasing demand for comprehensive characterization of the adhesion properties of ductile metallic multilayers on brittle substrates, particularly within the electronics and semiconductor industries, without causing damage to the substrates. Metallic soft layers such as gold (Au), platinum (Pt), copper (Cu), and silver (Ag) are known for their ductility, which presents challenges during scratch testing on brittle substrates using the conventional scratch method.
In our upcoming webinar, we will demonstrate a novel method for scratch analysis of ductile metallic layers deposited on fragile substrates. This innovative technique utilizes a micro wedge blade indenter in combination with a two-axes tilt stage sample holder, significantly enhancing the accuracy and reliability of scratch testing. The coatings analyzed using this approach are typically deposited through PVD, CVD, and ALD methods.
Dr. Mohammad Arab Pour Yazdi will explain how this novel method offers a reliable solution for assessing and improving the adhesion properties of ductile coatings on brittle substrates.
Webinar highlights:
- Adhesion of ductile metallic layers on fragile substrates
- Application of wedge blade indenter
- Two-axes tilt stage
- Adhesion of individual layer for multilayer coatings
This webinar is especially useful for:
- The semiconductor industry
- The optoelectronics industry
- The micro electro-mechanical systems industry
- The luxury industry, including the watch industry
- Research laboratories
- Testing laboratories
Dr. Mohammad Arab Pour Yazdi has been working as a Product Manager at Anton Paar TriTec in Switzerland since October 2022. He received his Ph.D. from the Université de Technologie de Belfort-Montbéliard (UTBM) in France in 2009. Before joining Anton Paar TriTec, he worked for 13 years as a researcher at UTBM. His research activities focused on the synthesis and characterization of thin films for energy and extreme environment applications.
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