Importance of Surface and Particle Charge In Tuning The Surface Properties of Materials in the Semiconductor Industry
Knowledge and control of surface properties of silicon wafers is extremely important in the development of new structuring processes in semiconductor device manufacturing. These structuring processes include photoresist application, exposure, leaching, etching, sputtering, and planarization processes. Among the structuring processes, the processing of photoresist, the deposition of metal layers, and the influence of additives on the wafer cleaning efficiency have been investigated in detail
2018-07-17, 13:00 - 14:00
Trainer: Vinod Radhakrishnan
Dr. Vinod Radhakrishnan is the Product Specialist for the Material Characterization division at Anton Paar USA. Dr. Radhakrishnan received his degrees in Chemical Engineering from Texas A&M University (MS) and Auburn University (Ph.D).
Contact person and registration:
Ms. Megan Boyd
Registration deadline is already over.