Charge Ahead: Relevance of Zeta Potential in the Semiconductor Industry
Controlling surface properties of silicon wafers is extremely important in semiconductor device manufacturing. Surface charge analysis can be applied as a direct tool to monitor wafer cleaning efficiency. During Chemical Mechanical Polishing (CMP), electrostatic repulsion of slurry particles by a wafer surface is driving the success of the process, as it directly prevents particle adhesion. Zeta potential analysis of particles and solids help to optimize slurry conditions and reduce the efforts in post-CMP cleaning.
In this webinar you will learn:
- how electrophoretic light scattering with Litesizer 500 and the measurement of streaming current with SurPASS 3 are applied to determine the zeta potential of slurry particles and wafer surfaces,
- how different etching strategies lead to different surface charge and
- how wafer-particle interactions can be used to favor CMP processes.
Christine Körner is the international product manager for solid surface charge instrumentation at the Anton Paar headquarters in Austria. She earned a PhD in Physical Chemistry from Graz University of Technology, Austria, as well as a degree in Business Administration before joining Anton Paar in 2011 as a product specialist for material characterization.
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