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Mikroskopi atomskih sila:
Tosca

Model:
  • Top-level AFM for entry-level budgets
  • Biggest sample stage in price segment (50 mm fully addressable)
  • Fastest time-to-measure on the market (only 3 min)
  • Scan size of 15 µm in Z and 90 µm x 90 µm in X and Y direction
  • Cantilever exchange in less than 10 seconds
  • All modes on the same sample spot without head exchange
  • Biggest sample stage in price segment (up to 200 mm for wafers)
  • Highest level of hard- and software automation for your AFM
  • Fastest time-to-measure on the market (only 3 min)
  • Cantilever exchange in less than 10 seconds
  • All modes on the same sample spot without head exchange
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Serija Tosca kombinira vrhunsku tehnologiju s vremenski učinkovitim radom, zbog čega je ovaj AFM savršen alat za analizu nanotehnologije za znanstvenike i slične industrijske korisnike.

Odaberite između dva različita modela: Tosca 400, za velike uzorke, vrhunski AFM ili Tosca 200, AFM za uzorke srednjih veličina i ograničene budžete. Oba pružaju istu razinu performansi, fleksibilnosti i kvalitete.

Svaki Tosca uređaj dolazi s: tri godine garancije, tri vaučera za obuku korisnika i vaučerima za detaljna izvješća o mjerenju do deset uzoraka po vašem izboru.
Sve o paketu korisničke podrške za seriju Tosca

Learning to use the AFM
Learning to use the AFM
  • Training takes only 1 hour
  • 12 x faster than conventional AFMs

Challenge

I want to get started straight away. How much time do I need to learn to use Tosca?

Solution

Tosca is so easy to operate that training for use with the standard modes only takes one hour.

Your benefits & time

With Tosca you can start your first measurment after one hour of training instead of 1.5 days on conventional AFMs.

Preparing samples for measurement
Preparing samples for measurement
  • No sample preparation required
  • Measure large samples directly
  • Sample stage: 100 mm diameter (up to 200 mm diameter for wafers), 25 mm height 

Challenge

Cutting and slicing samples can result in damage and contamination. How can I avoid this?

Solution

Forget sample preparation and the associated risk of contamination or falsified results. With Tosca you can directly measure large samples of up to 25 mm in height and up to 100 mm in diameter.

Your benefits & time

With Tosca you get accurate results and can skip this tedious preparation step. Time saved: up to 15 minutes, depending on the sample.

Cantilever loading
Cantilever loading
  • Position your cantilever in 10 seconds
  • 100 % correct alignment
  • No cantilever breakage

Challenge

Cantilever exchange and positioning is tricky and time-consuming. Is there a better way?

Solution

Use the patented Probemaster for hands-free cantilever exchange in 10 seconds.

PATENT: AT520313 (B1)

Your benefits & time saved

Probemaster quickly positions your cantilever, prevents damage, and enables proper alignment.

Sample loading
Sample loading
  • Load multiple samples and measure them all in one run
  • Save up to 20 minutes on repeated sample replacement
  • Secure the sample carrier with the magnetic lock

Challenge

Is it possible to load more than one sample to streamline the process?

Solution

Load multiple samples and measure them in one run. Tosca's patented magnetic lock ensures stable positioning of the samples.

PATENT: AT515951 (B1)

Your benefits & time saved

Fix the samples on the large carrier at the location of your choice and rely on stable positioning. Measure multiple samples in one step. Time saved: depending on the user, up to 20 minutes per sample.

Laser alignment
Laser alignment
  • Fully automatic laser alignment in 5 seconds
  • Just takes two mouse-clicks in the software

Challenge

Manual alignment of the laser is a tedious procedure that also requires expertise. Is there an alternative?

Solution

Tosca provides fully automatic laser alignment in 5 seconds.

PATENT: AT520419 (B1)

Your benefits & time saved

The Tosca automatic laser alignment feature makes you an alignment expert. It only takes you two clicks in the software. Time saved: up to 5 minutes per alignment.

Approach
Approach
  • Patented side-view camera shows you the exact cantilever position over the surface
  • Safe and quick approach
  • No risk of head crash

Challenge

Getting the approach right is difficult. How can I avoid head crash and cope with complex geometries, transparent samples, and samples embedded in glass?

Solution

Tosca's patented side-view camera allows for the safest and easiest engagement procedure on the market.

PATENT: EP3324194B1  

Your benefits & time saved

Using the horizontal view of the cantilever over the sample surface lets you visually monitor the approach. Time saved: depending on the sample and user, 5 to 10 minutes with significantly lower risk of failure.

Navigation
Navigation
  • Three cameras show the sample at all levels
  • Just click and move into the cm, µm, or nm scale view
  • Save 5 to 10 minutes per measurement

Challenge

Finding the area of interest on the sample requires time and patience. How can I optimize this procedure?

Solution

Tosca implements an intuitive click-and-move navigation: just click on the region of interest for immediate automatic navigation instead of time-consuming manual positioning.

Your benefits & time saved

Navigation only requires a single mouse-click, possible on a large scale from cm, µm, down to nm with three integrated cameras. Time saved: 5 to 10 minutes per measurement with the additional benefit of convenience.

Data analysis
Data analysis
  • Always keep raw data and trace impact of all analysis steps
  • Templates and batch analysis
  • Reports complete in 5 seconds

Challenge

I need an analysis software with a range of analysis possibilities and templates. I also need the option of tracing all analysis steps.

Solution

Use the Tosca Analysis templates to obtain complete reports within seconds. Each individual analysis operation is recorded, so you can trace the raw data handling at all times.

Your benefits & time saved

You only need to load the raw data, also multiple data from batch measurements, and the report is completed within 5 seconds. Time saved: up to 20 minutes per analysis report.

Polymer sample
  • Contact resonance amplitude imaging
  • Image size 10 µm x 10 µm
  • Resolution 500 px x 500 px

Details

PMMA/SBS polymer blend. Superposition of topography and mechnical properties. Image size 10 µm x 10 µm, resolution 500 px x 500 px.

Mode

Contact resonance amplitude imaging

Research topic

The distribution of both polymers define the mechanical properties of thin films. CRAI mode is used for topography as well as phase analysis.

Nanofibers sample
  • Tapping mode
  • Image size 25 µm x 25 µm
  • Resolution 1000 px x 1000 px

Details

Fiber network of polycaprolactone (PCL). High-resolution topographic image for evaluation of critical dimensions. Image size 25 µm x 25 µm, resolution 1000 px x 1000 px.

Mode

Tapping mode

Research topic

The PCL nanofibers are a promising material for various biomedical applications. The topography analysis reveals the diameter of the nanofibers between 80 nm and 400 nm.

Microelectronics sample
  • Conductive atomic force microcsopy
  • Image size 564 nm x 564 nm
  • Resolution 400 px x 400 px

Details

Microelectronic components consisting of conductive oxide particles in an isolating glass matrix. Superposition of topography and current map. Image size 564 nm x 564 nm, resolution 400 px x 400 px.

Mode

Conductive atomic force microcsopy

Research topic

C-AFM can be used to identify electrically weak spots in dielectric coatings or to image the conductive path in a microelectronic component or materials for electrodes.

Polished wafer sample
  • Tapping mode
  • Image size 1 µm x 1 µm
  • Resolution 500 px x 500 px

Details

(100) oriented surface of silicon wafer. High resolution topographic image for evaluation of surface roughness. Image size 1 µm x1 µm, resolution 500 px x 500 px, RMS surface roughness 137 pm.

Mode

Tapping mode

Research topic

The surface roughness of wafers is an important quality parameter for the subsequent processes of micro-structuring. AFM systems must be able to image the surface of highly polished materials with very low surface roughness in the range of 150 pm – with high quality and reliability. 

Quantum dots sample
  • Tapping mode
  • Image size 1200 nm x 750 nm
  • Resolution 800 px x 800 px

Details

Self-assembled indium arsenide (InAs) quantum dots (QD) in gallium-arsenide (GaAs) grown on a (100) oriented surface of a Gallium arsenide wafer. High resolution topographic image for evaluation of the dimension and lateral distribution of the QDs. Image size 1200 nm x 750 nm, resolution 800 px x 800 px.

Mode

Tapping mode

Research topic

Quantum dots (QD) are a field of intensive research activity due to their potential future application in electronics and digitalization. The dimensions of individual QD and lateral distribution constitute important information for the production process. The terraces visible in the image are the atomic steps of the GaAs substrate material, with an individual step height of approximately 280 pm.

Tehničke specifikacije

Tosca 400
Veliki uzorci
Tosca 200
Uzorci srednje veličine
Skener
Raspon X-Y snimanja 100 µm x 100 µm 50 µm x 50 µm*
Raspon Z snimanja 15 µm 10 µm**
Maks. brzina skeniranja 10 linija/s 5 linija/s
Uzorak
Maks. promjer uzorka 100 mm 50 mm
Maks. visina uzorka 25 mm
Maks. težina uzorka <600g
Ponovljivost položaja
(jednosmjerno)
<1 µm
Videomikroskop
Kamera u boji, 5 megapiksela, CMOS senzor
Vidno polje 1,73 mm x 1,73 mm
Prostorna razlučivost 5 µm
Fokus motorizirani fokus
Kamera za pregled
Kamera u boji, 5 megapiksela, CMOS senzor
Vidno polje 40 mm x 40 mm
Prostorna razlučivost 50 µm
Kamera za bočni prikaz
Kamera za bočni prikaz crno-bijela, raspon prikaza 30 mm
Načini rada
Standardni načini rada Kontaktni način rada, način rada s grananjem (uključujući faznu sliku), mikroskopija bočnih sila, krivulja udaljenosti sile
Opcionalni načini rada Snimanje amplitude kontaktne rezonance, mikroskopija magnetskih sila, mikroskopija sila Kelvinovom sondom, mikroskopija elektrostatičkih sila, provodljiva mikroskopija atomskih sila, trenutna kontrolna provodljiva mikroskopija atomskih sila
Dimenzije i težina
Veličina (D x Š x V), AFM jedinica 490 mm x 410 mm x 505 mm
Veličina (D x Š x V), kontroler 340 mm x 305 mm x 280 mm
Težina, AFM jedinica 51,1 kg
Težina, kontroler 7,8 kg

* opcionalna nadogradnja na 90 µm x 90 µm

** opcionalna nadogradnja na 12 µm ili 15 µm

Tosca je registrirani zaštitni znak (013412143) tvrtke Anton Paar.

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Pribor za mikroskop atomskih sila Tosca 400:
Wafer Stage

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Softver za mikroskop atomskih sila:
Tosca Control i Tosca Analysis

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