Residual Stress and Electrical Resistance Characterization in Copper Films on Polyethylene terephtalate (PET)
A composite material consisting of a Cu film deposited on a PET substrate is investigated under tensile stress using in-situ XRD. The results show that the effect of strain on the electrical re-sistance of the film and how the viscoelastic properties of the film and substrate affect the film behavior on relaxation.
Flexible electronics, the assembly of electronic circuits on polymer substrates, is an emerging technology field. This is due to the many advantages compared to classical electronic boards, like mechanical flexibility, light weight and the possibility to fabricate large areas.
The understanding of the mechanical and fracture properties of such composites is essential before bringing this technology to mass production. In the case that the electrical connection between the elements of the electronic device is achieved by the metallization with copper layers, stability of these layers, bonded to the polymer is a key issue. In this study copper (Cu) thin films on PET were characterized during loading and unloading experiments in order to understand the relationship between applied strain, stress and electrical properties (1).
1. Glushko, O.; Marx, V.M.; Kirchlechner, C.; Zizak, I.; Cordill, M.J. Thin Solid Films (2014) 552, 141- 145
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