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Atomic Force Microscopes:
Tosca

Model:
  • Top-level AFM for entry-level budgets
  • Biggest sample stage in price segment (50 mm fully addressable)
  • Fastest time-to-measure on the market (only 3 min)
  • Scan size of 15 µm in Z and 90 µm x 90 µm in X and Y direction
  • Cantilever exchange in less than 10 seconds
  • All modes on the same sample spot without head exchange
  • Biggest sample stage in price segment (up to 200 mm for wafers)
  • Highest level of hard- and software automation for your AFM
  • Fastest time-to-measure on the market (only 3 min)
  • Cantilever exchange in less than 10 seconds
  • All modes on the same sample spot without head exchange
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Top-level AFM for entry-level budgets: with the fastest measurement setup and largest sample stage, the Tosca series will keep up with your AFM nano surface analysis.

Tosca is the first choice for researchers, pioneers, thinkers, and creators in nanotechnology material science.

Mode switching with head exchange was yesterday: Tosca enables measurement on the exact same spot using all available modes combined in one head.

All about the Tosca Care Package

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Benefits

Patented, intelligent features covering each step in the AFM measurement procedure create a unique, highly streamlined AFM workflow enabling 10 times faster results than with conventional AFM systems.

Instead of spending days learning to operate the AFM, start measuring after 1 hour. Fast and safe cantilever loading in seconds, automatic laser alignment, the most intuitive sample navigation, and the safest engagement procedure on the market lead you to your goal: more time to focus on your research results.

Learning to use the AFM
Learning to use the AFM
  • Training takes only 1 hour
  • 12 x faster than conventional AFMs

Challenge

I want to get started straight away. How much time do I need to learn to use Tosca?

Solution

Tosca is so easy to operate that training for use with the standard modes only takes one hour.

Your benefits & time

With Tosca you can start your first measurment after one hour of training instead of 1.5 days on conventional AFMs.

Preparing samples for measurement
Preparing samples for measurement
  • No sample preparation required
  • Measure large samples directly
  • Sample stage: 100 mm diameter (up to 200 mm diameter for wafers), 25 mm height 

Challenge

Cutting and slicing samples can result in damage and contamination. How can I avoid this?

Solution

Forget sample preparation and the associated risk of contamination or falsified results. With Tosca you can directly measure large samples of up to 25 mm in height and up to 100 mm in diameter.

Your benefits & time

With Tosca you get accurate results and can skip this tedious preparation step. Time saved: up to 15 minutes, depending on the sample.

Cantilever loading
Cantilever loading
  • Position your cantilever in 10 seconds
  • 100 % correct alignment
  • No cantilever breakage

Challenge

Cantilever exchange and positioning is tricky and time-consuming. Is there a better way?

Solution

Use the patented Probemaster for hands-free cantilever exchange in 10 seconds.

PATENT: AT520313 (B1)

Your benefits & time saved

Probemaster quickly positions your cantilever, prevents damage, and enables proper alignment.

Sample loading
Sample loading
  • Load multiple samples and measure them all in one run
  • Save up to 20 minutes on repeated sample replacement
  • Secure the sample carrier with the magnetic lock

Challenge

Is it possible to load more than one sample to streamline the process?

Solution

Load multiple samples and measure them in one run. Tosca's patented magnetic lock ensures stable positinoning of the samples.

PATENT: AT515951 (B1)

Your benefits & time saved

Fix the samples on the large carrier at the location of your choice and rely on stable positioning. Measure multiple samples in one step. Time saved: depending on the user, up to 20 minutes per sample.

Laser alignment
Laser alignment
  • Fully automatic laser alignment in 5 seconds
  • Just takes two mouse-clicks in the software

Challenge

Manual alignment of the laser is a tedious procedure that also requires expertise. Is there an alternative?

Solution

Tosca provides fully automatic laser alignment in 5 seconds.

PATENT: AT520419 (B1)

Your benefits & time saved

The Tosca automatic laser alignment feature makes you an alignment expert. It only takes you two clicks in the software. Time saved: up to 5 minutes per alignment.

Approach
Approach
  • Patented side-view camera shows you the exact cantilever position over the surface
  • Safe and quick approach
  • No risk of head crash

Challenge

Getting the approach right is difficult. How can I avoid head crash and cope with complex geometries, transparent samples, and samples embedded in glass?

Solution

Tosca's patented side-view camera allows for the safest and easiest engagement procedure on the market.

PATENT: EP3324194B1  

Your benefits & time saved

Using the horizontal view of the cantilever over the sample surface lets you visually monitor the approach. Time saved: depending on the sample and user, 5 to 10 minutes with significantly lower risk of failure.

Navigation
Navigation
  • Three cameras show the sample at all levels
  • Just click and move into the cm, µm, or nm scale view
  • Save 5 to 10 minutes per measurement

Challenge

Finding the area of interest on the sample requires time and patience. How can I optimize this procedure?

Solution

Tosca implements an intuitive click-and-move navigation: just click on the region of interest for immediate automatic navigation instead of time-consuming manual positioning.

Your benefits & time saved

Navigation only requires a single mouse-click, possible on a large scale from cm, µm, down to nm with three integrated cameras. Time saved: 5 to 10 minutes per measurement with the additional benefit of convenience.

Data analysis
Data analysis
  • Always keep raw data and trace impact of all analysis steps
  • Templates and batch analysis
  • Reports complete in 5 seconds

Challenge

I need an analysis software with a range of analysis possibilities and templates. I also need the option of tracing all analysis steps.

Solution

Use the Tosca Analysis templates to obtain complete reports within seconds. Each individual analysis operation is recorded, so you can trace the raw data handling at all times.

Your benefits & time saved

You only need to load the raw data, also multiple data from batch measurements, and the report is completed within 5 seconds. Time saved: up to 20 minutes per analysis report.

Polymer sample
  • Contact resonance amplitude imaging
  • Image size 10 µm x 10 µm
  • Resolution 500 px x 500 px

Details

PMMA/SBS polymer blend. Superposition of topography and mechnical properties. Image size 10 µm x 10 µm, resolution 500 px x 500 px.

Mode

Contact resonance amplitude imaging

Research topic

The distribution of both polymers define the mechanical properties of thin films. CRAI mode is used for topography as well as phase analysis.

Nanofibers sample
  • Tapping mode
  • Image size 25 µm x 25 µm
  • Resolution 1000 px x 1000 px

Details

Fiber network of polycaprolactone (PCL). High-resolution topographic image for evaluation of critical dimensions. Image size 25 µm x 25 µm, resolution 1000 px x 1000 px.

Mode

Tapping mode

Research topic

The PCL nanofibers are a promising material for various biomedical applications. The topography analysis reveals the diameter of the nanofibers between 80 nm and 400 nm.

Microelectronics sample
  • Conductive atomic force microcsopy
  • Image size 564 nm x 564 nm
  • Resolution 400 px x 400 px

Details

Microelectronic components consisting of conductive oxide particles in an isolating glass matrix. Superposition of topography and current map. Image size 564 nm x 564 nm, resolution 400 px x 400 px.

Mode

Conductive atomic force microcsopy

Research topic

C-AFM can be used to identify electrically weak spots in dielectric coatings or to image the conductive path in a microelectronic component or materials for electrodes.

Wafer metallization sample
  • Tapping mode
  • Image size 20 µm x 20 µm
  • Resolution 1000 px x 1000 px

Details

Silicon wafer for semiconductor production. Surface after metallization. Image size 20 µm x 20 µm, resolution 1000 px x 1000 px.

Mode

Tapping mode

Research topic

Precise grain size and surface roughness analysis are highly important parameters for the metallization steps in wafer production.

Technical specifications

Tosca 400 Tosca 200
Scanner
X-Y scan range 100 µm x 100 µm 50 µm x 50 µm*
Z scan range 15 µm 10 µm**
Max. scan speed 10 lines/s 5 lines/s
Sample
Max. sample diameter 100 mm (200 mm***) 50 mm
Max. sample height 25 mm (2 mm***)
Max. sample weight <600 g
Position repeatability
(uni-directional)
<1 µm
Video microscope
Camera Color, 5 megapixel, CMOS sensor
Field of view 1.73 mm x 1.73 mm
Spatial resolution 5 µm
Focus Motorized focus
Overview camera
Camera Color, 5 megapixel, CMOS sensor
Field of view 40 mm x 40 mm
Spatial resolution 50 µm
Side-view camera
Side-view camera Black and white, range of view 30 mm
Modes
Standard modes Contact mode, tapping mode (including phase image), lateral force microscopy, force distance curve
Optional modes Contact resonance amplitude imaging, magnetic force microscopy, Kelvin probe force microscopy, electrostatic force microscopy, conductive atomic force microscopy, current control conductive atomic force microscopy
Dimensions and weight
Size (D x W x H), AFM unit 490 mm x 410 mm x 505 mm
Size (D x W x H), controller 340 mm x 305 mm x 280 mm
Weight, AFM unit 51.1 kg
Weight, controller 7.8 kg

* optional upgrade to 90 µm x 90 µm

** optional upgrade to 12 µm or 15 µm

*** when using the Wafer Stage (optional)

Tosca is a registered trademark (013412143) of Anton Paar.

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  • Qualified support in your local language
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